What does TDP stand for?

TDP? What exactly that is, even today in many forums and blog comments is discussed. But let’s start from scratch: TDP is given as the power value of computer processors. The abbreviation TDP stands for Thermal Design Power and indicates the thermal power loss (in watts) of computer processors. Since a processor converts the absorbed electrical energy almost one-to-one into heat, the thermal power loss is a very important indicator of how much cooling and power is required.

Definition of TDP according to Intel

Intel defines TDP in one of its white papers as follows: „The upper point of the thermal profile consists of the Thermal Design Power (TDP) and the associated Tcase¬ value.  Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate.”

Tcase describes the temperature measurement via a thermocouple embedded in the middle of the heat spreader. The original measurement is made at the factory. After production, Tcase is calibrated by the BIOS system. For this, the measurement results are read on a diode between and under the cores. (Source: Intel)

According to Intel, TDP is a guideline, among other things, for the recommended heat dissipation. At the same time the Thermal Design Power says nothing about the maximum possible power output.

ComputerBase.de adds a further definition of Intel in one of their recent articles. According to this, TDP also stands for “the average power consumption (in watts) which the processor derives at base frequency when all cores are active in a highly complex workload, defined by Intel.” We can only speculate what exactly is meant by a “highly complex workload”.
However, what is clear from this definition is that the Thermal Design Power in no way depends on the turbo clock speeds of a processor. Since the Thermal Design Power refers specifically to the base clock of a CPU, could therefore not be deduced from how much power a processor rakes up during the day.

Definition of TDP according to AMD

Intel also mentions AMD's definition of Thermal Design Power in its whitepaper. AMD’s understanding of TDP: "The Thermal Design Power is the maximum power a processor can draw for a thermally significant period while running commercial software. The constraining conditions for TDP are specified in the notes in the thermal and power tables."

ComputerBase.de also lists another definition of AMD:
"The TDP is a strict measure of the thermal power dissipation of an ASIC (= Application-Specific Integrated Circuit) that defines the minimum cooling needed to achieve the specified performance."
Consequently, this would mean that a CPU can only achieve the intended performance as long as the performance is not throttled by too high a temperature.

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25 Jun 2018 Array ( [id] => 334 [title] => What’s New? No more Windows 7 support and new AMD Ryzen CPUs [authorId] => [active] => 1 [shortDescription] => Half of the year has passed and in the IT market things are going wild. In this article we talk about Microsoft, who are shutting down Windows 7 updates for Kabylake CPUs. Also we want to mention the new AMD embedded CPUs that set new benchmarks regarding high performance. [description] =>

AMD CPUs for max performance in Embedded-Computing

With their latest embedded CPUs, that are called Ryzen, AMD sets a new benchmark and starts the fire against its competitor Intel. These CPUs are mostly made for embedded applications where high performance is a must. This counts for example for digital signage scenarios, which have to process high resolution 4K content. But also the use in smart robotics and in the field of vehicle computing. Furthermore these new AMD CPUs contain an integrated GPU, which complies with the latest AMD Radeon Vega architecture.

Source: elektronikpraxis.vogel.de

AMDs 7nm next level GPU

This year AMD drops a bombshell on the Computex: The chip developer from the USA announces that in this year they will bring professional Radeon-Intstrinct products based on Vega-20-GPU on the market. These are made with the 7nm process and especially for the B2B market. If consumer will get a taste of these Vega-20 products is still unsure. But what is totally sure is that even gamers will get the taste of them. In addition to this AMD didn’t say anything about the technical specifications. Only so much was released that there will be a memory extension of 32 Gigabyte HBM 2, which will – because of the four HBM2 stacks – increase the memory bandwith up to 4.096.

Source: computerbase.de

No more Windows 7 support

Yet last year Microsoft and Intel announced that the latest CPUs will only be supported with a current Windows – by which they mean Windows 10. This means, upon reversion, that there will no longer be a driver support for Kabylake CPUs that work under Windows 7 and 8.1. Skylake CPUs with Windows 7 still have support until 2020. Microsoft suggests upgrading to Windows 10 if you have a CPU that was released after August 2016. By this time the yet mentioned Kabylake generation is concerned as well as the Coffeelake generation from October 2017.
Due to this also spo-comm provides only Windows 10 support for new Mini-PCs.

Source: heise.de

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know-how
What’s New? No more Windows 7 support and new AMD Ryzen CPUs
Half of the year has passed and in the IT market things are going wild. In this article we talk about Microsoft, who are shutting down Windows 7 updates for Kabylake CPUs. Also we want to mention the new AMD embedded CPUs that set new benchmarks regarding high performance.
27 Jun 2018 Array ( [id] => 336 [title] => What is the difference between 4K and 8K? [authorId] => [active] => 1 [shortDescription] => While dealing with the topic of PC monitors, TVs or other devices, that show pictures or play video content, it won’t take much time until the terms UHD or 4K are mentioned. By now even the 8K-resolution is a very important thing. In the following article we want to explain what stands behind these terms and in what exactly makes them different. [description] =>

UHD, 4K and 8K – What is the connection?

Let’s talk about terminology first: UHD stands for Ultra High Definition. The “K” in 4K and 8K for the number thousand. Below in the text we explain you what this is all about.
The term UHD includes two different resolutions. One of them is UHD-1, the other UHD-2. The former one has a resolutions of 3840 × 2160 pixels and stands for what is in the common language known as 4K. In cinemas 4K has another resolution, in fact 4096 × 2160 pixels. These 4096 horizontal pixels stand for the term 4K – which means 4-thousand.

UHD-2 or 8K – Not only dreams of the future

8K has twice the amount of both horizontal and vertical pixels than 4K. That leads to the fourfold amount of pixels – overall 33 million – and corresponds to a resolution of 7680 × 4320 pixels.
But not only does the resolution increase: The color range (WCG, Wider Color Gamut) and the contrast range (HDR, Higher Dynamic Range) extend, as well as the image repeat rate that goes up to a maximum of 120fps.

HDMI 2.1 – From 4K over 8K up to a resolution of 10K

Due to the data rate of 24 Gbit/s 8K needs a special cable that suits this requirement. In January 2017 the HDMI forum released the final specifications for a fitting cable. It is the successor of HDMI 2.0, which is simply called HDMI 2.1. With the support of a 48 Gbit/s data rate this cable makes 8K@60Hz possible and even exceeds the DisplayPort-standard that allows a data rate of 32 Gbit/s in its version 1.3 (see also “VGA, DisplayPort, HDMI, DVI – what’s the difference between these multimedia interfaces?”). By compressing the HDMI 2.1 cable even a resolution of 10.328 × 7.760, that’s 10K, is possible.

8K with Mini-PCs from spo-comm

At the moment we have two Mini-PCs in our product range that are able to play 8K content. One of them is our well-known Digital Signage player: The spo-book KUMO IV. This active cooled Mini-PC can play content in an 8K resolution due to its dedicated nVidia GTX 1060 graphics card with a VRAM of 6GB DDR5. The second Mini-PC is even the latest in our product range – the spo-book RUGGED GTX 1050 Ti. The system is equipped with a dedicated graphics card, too, and has furthermore a passive cooling system. As the PCs name suggests, the graphics card is an nVidia GTX 1050 Ti with a memory of 4GB and a VRAM up to 32GB high. At the same time four out of seven HDMI connectors make an 8K videowall possible.

That sounds interesting?

##Configure your spo-book KUMO V and test it for free!

##Configure your spo-book RUGGED GTX1050 Ti and test it for free!

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know-how
What is the difference between 4K and 8K?
While dealing with the topic of PC monitors, TVs or other devices, that show pictures or play video content, it won’t take much time until the terms UHD or 4K are mentioned. By now even the 8K-resolution is a very important thing. In the following article we want to explain what stands behind these terms and in what exactly makes them different.
22 May 2018 Array ( [id] => 330 [title] => NEW: spo-book WINDBOX III EVO – Configuration diversity for every application field [authorId] => [active] => 1 [shortDescription] => Together with the Taiwanese partner MSI IPC the spo-comm developed a new Mini-PC from the well-known WINDBOX series. We present to you: The WINDBOX III EVO. With the already existing quality of the WINDBOX series that stands for a versatile application scenario, its reliability and an unbeatable price, the new model of this line convinces us, too. [description] =>

As well as the predecessor models, the WINDBOX III EVO has the measurements 300 x 196 x 30 mm and can still be mounted behind monitors or under office desks by help of the standard VESA-mountings (see also “What is VESA?”). It also has the same weight as the older models which makes it really easy to integrate the PC into already existing systems.

Improved performance and consistent WINDBOX features

Our new spo-book WINDBOX III EVO is equipped with a seventh generation Intel Core i5 processor that works with up to 3,1 Gigahertz and is supported by a RAM where you can choose up to 32GB. Thereby demanding multi monitoring is possible but also single running applications can use the CPU performance perfectly. The main feature of the WINDBOX is still the passive cooling system: Absolute silent working in places where this is totally necessary is no problem. With the wide range temperature from -10° Celsius to 50° Celsius and the completely closed metal housing, through which dust and dirt can’t reach the interior, this Mini-PC can be used for applications with difficult conditions. The high quality of the components makes sure the Embedded-PC can be used 24/7.

Interface diversity for every application field

With the large amount of video outputs the WINDBOX III EVO conquers the Digital Signage field in a new way: One DVI- and two DisplayPort-interfaces can control up to three monitors at the same time – no matter if you want to play the same or different content (see also “VGA, DisplayPort, HDMI, DVI – what’s the difference between these multimedia interfaces?”). The high claims of this application field are for sure fulfilled by this Embedded-PC: Without any delays 4K-content can be played. The standard of 1080p in the Digital-Signage field is also removed by this.

The high variety of interfaces guarantees that the WINDBOX III EVO can work together with already existing configurations. Due to two Gigabit-LAN-interfaces and an optional WiFi and Bluetooth network connections can be made, but also wireless data transfer is possible.

Equipped with 6 USB ports – four of them after the latest 3.0 standard – the Mini-PC can be connected to numerous systems and external storage media. By choosing your desired configuration the WINDBOX III EVO can be adapted to every application scenario.

No Windows 7 support

As of now, Intel and Microsoft do not longer provide a driver support for Kabylake-CPUs with Windows 7. For our customers this means that in the future we only offer support for Windows 10.

With immediate effect you can configure, test and buy our new WINDBOX III EVO on our website.

##Configure your WINDBOX III EVO!

##Explore all spo-comm Mini-PCs

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products
NEW: spo-book WINDBOX III EVO – Configuration diversity for every application field
Together with the Taiwanese partner MSI IPC the spo-comm developed a new Mini-PC from the well-known WINDBOX series. We present to you: The WINDBOX III EVO. With the already existing quality of the WINDBOX series that stands for a versatile application scenario, its reliability and an unbeatable price, the new model of this line convinces us, too.