spo-comm at the embedded world 2012 in Nuremberg

The embedded world Exhibition & Conference 2012 is the world’s largest international trade fair and congress event for all things connected with Embedded Systems. Like in the last years since 2009 spo-comm is taking part again.

From the 28th of February until the 1st of March we will present besides our well known products and solutions, some brand new systems, like the spo-book WINDBOX II Plus.

You will find our booth No. 1-122 in Hall 1.

Please get in touch with us for further information or to make an appointment.

More on this topic

27 Aug 2012 detail

Die NANO Familie von spo-comm bekommt Zuwachs

Ein Jahr nach Einführung der NANO Produktlinie wird diese um zwei weitere, attraktive Mini-PCs erweitert.
26 Jul 2012 products

WINDBOX III+: MSI and spo-comm’s common masterpiece

Never change a winning team: Together with MSI spo-comm now continues the success story of the WINDBOX with the latest version WINDBOXIII+. Above all spo-comm’s management is very pleased about the strong commitment and voice they have during the development process in the meanwhile.
8 Jun 2010 company

spo-comm receives MSI IPC Award

MSI Industrial IPC Headquarter Taipei awards spo-comm for outstanding partnershipspo-comm, Germany and Europe partner of netbook provider MSI, received award from IPC Department MSI Taiwan for outstanding and powerful partnership.